SUMMARY:QuantitativelyunderstandstressrelatedfailureinMPSproductsandfindoptimizationbyFEAintrouble-shooting,andpredictstressrisksinproductdesignphase.RESPONSIBILITIES:?Mechanicalorthermalstressanalysisonpackagelevel&boardlevel;?Parametricanalysisonrankingkeyimpactfactorsforimprovedproductreliability;?ProvideimprovementsolutionforICpackagingrelatedfracture,fatigue,warpage,interfacedelaminationissuesthroughFEAsimulationatbothearlyfailureandlongtermfailurestage;?Classifystressrelatedfailureandaccordinglythefailuremechanisms;?Optimizedevice&packagestructureordesigntomitigatecrackingrelatedfailurefromstress,warpage,material,andmanufacturingperspective;REQUIREMENTS:?Educationbackground:MSdegreeinMechanicalEngineering,EngineeringMechanics,Materials,stronginmechanicsofmaterials&fracturemechanics;PhDisplus;?Hands-onexperienceofmajorFEAtools(e.g.,ANSYS,ABAQUS,Hypermesh,,etc);?knowledge&experienceofthermal-mechanicalcharacterizationofelectronicpackagingmaterials,andmechanicalbehaviorofthematerials;?Knowledgeofboardlevelpackage,experienceofmechanicaldesignusingFEAastool(designformanufacture,designforreliability);?Goodteamplayer,andabletoperformindependentresearch&developmentwork;?Experienceonsomeofthefollowingisplus:*bigsizePCBboard(>50*50)warpagesimulationwithcalibratedgoodaccuracy;*bigsizeBGA(>50*50)fatiguelifesimulationwithcalibratedgoodaccuracy;*knowingfailuremodesandmechanisminadvanced2.5D/3Dpackage,andexperienceindefiningtheirmechanicaldesignguidelines;*vibrationsimuforboardlevelpackageusedinAEC1environments;职能类别：仿真应用工程师关键字：mechanicalboardinterfaceicpackagingfatiguewarpagestress
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