SUMMARY:Heatdissipationquantitativeanalysis&heatdesignoptimization,Component&systemlevelheatdissipationsimulation.RESPONSIBILITIES:?UtilizethermalsimulationsoftwaresuchasANSYSIcepak,FloTHERM,etc.,toanalyzethethermalperformanceofpackage/boardandsystemlevelundervariousoperatingconditions.?Providethermalresistanceparametersandthermalmodels.?Providerecommendationsfordesignoptimizationbasedonsimulationresultstoenhanceheatdissipationefficiencyandthermalmanagementcapabilities.?Workwithdesignteamtoaddressthermalissues,makesureproductthermaldesignfirsttimeright.?Stayupdatedonthelatestadvancementsinthermalsimulationtechnologiesandtoolstocontinuouslyenhancetheteam'ssimulationcapabilities.?Assistinengineeringmaterialthermalpropertycharacterization.REQUIREMENTS:?BSorabovedegreeinEngineeringMechanics,orengineeringMaterials,orelectronicsrelated;?Hands-onexperienceofmajorFEAtools(ANSYS,ABAQUS,Comsol,Icepak,Flotherm,etc.)andmodelingtools(e.g.,Solidworks,ProE,etc);?Experienceofboardlevelorsystemlevelheatdissipationmanagement;?ExperienceorprojectsrelatedtomachinelearningIsplus;职能类别：仿真应用工程师关键字：simulationflothermheatboardparametersansysicepakmanagementpackage
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